Produktdetails:
Zahlung und Versand AGB:
|
| Material: | Kupfer/moly/Kupfer | Dichte: | 9,66 |
|---|---|---|---|
| CTE: | 6,8 | TC: | 190 |
| Markieren: | tungsten copper heat spreader,copper molybdenum heat base |
||
Cu/Mo/Cu carrier Hermetic Packages Electronics Material CMC Flange
Description:
| Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) |
| CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) |
| CMC131 | 9.66 | 6.8 | 244(XY)/190(Z) |
| CMC141 | 9.75 | 6 | 220(XY)/180(Z) |
| CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z) |
Application:
Cu/Mo/Cu(CMC) carrier has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
Product picture:
